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EMIF06-VID01C2
IPADTM 6 line low capacitance EMI filter and ESD protection
Main application
Where EMI filtering in ESD sensitive equipment is required:

LCD and camera for mobile phones Computers and printers Communication systems MCU board
(R)
Description
The EMIF06-VID01C2 is a 6 line highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. The Flip-Chip packaging means the package size is equal to the die size. This filter includes ESD protection circuitry, which prevents damage to the application when it is subjected to ESD surges up to 15 kV.
Lead free coated Flip-Chip (15 Bumps)
Order code
Part Number EMIF06-VID01C2 Marking GR
Pin identities (bump side) Benefits

High efficiency EMI filtering (-40db @ 900MHz) Low line capacitance suitable for high speed data bus Low serial resistance for camera impedance adaptation Optimized PCB space consuming: 2.92mm x 1.29mm Very thin package: 0.69 mm High efficiency in ESD suppression on inputs pins (IEC61000-4-2 level 4) High reliability offered by monolithic integration High reducing of parasitic elements through integration and wafer level packaging Lead free package
9
8
7
6
5
4
3
2
1
I6 Gnd O6
I5
I4 Gnd O4
I3
I2 Gnd O2
I1
A B
O5
O3
O1
C
Circuit configuration
R
Input
Output
Complies with the following standards:
IEC 61000-4-2
level 4 input pins 15 kV 8 kV (air discharge) (contact discharge
R = 100 CLINE = 16pF typ. @ 3V
MIL STD 883E - Method 3015-6 Class 3
June 2006
Rev 2
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Characteristics
EMIF06-VID01C2
1
Characteristics
Table 1.
Symbol Tj Top Tstg
Absolute Ratings (limiting values)
Parameter and test conditions Maximum junction temperature Operating temperature range Storage temperature range Value 125 - 40 to + 85 - 55 to + 150 Unit C C C
Table 2.
Symbol VBR IRM VRM R Cline
Electrical Characteristics (Tamb = 25 C)
Parameter Breakdown voltage Leakage current @ VRM
VBR VRM IR IRM IRM IR VRM VBR I
Stand-off voltage Series resistance between Input and Output Input capacitance per line
V
Symbol VBR IRM R Cline IR = 1 mA
Test conditions
Min. 6
Typ. 8
Max. 10 500
Unit V nA pF
VRM = 3 V per line I = 10 mA VR = 3 V DC 1 MHz VOSC = 30 mV 80 100 16
120 19
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EMIF06-VID01C2
Characteristics
Figure 1.
0 dB -10
S21 (db) attenuation measurement Figure 2.
0 dB -10 -20 -30
Analog crosstalk measurement
-20
-40
-30
-50 -60
-40
-70 -80
-50
-90
-60 100k 1M 10M f/Hz 100M 1G
-100 100k 1M 10M f/Hz 100M 1G
Figure 3.
ESD response to IEC 61000-4-2 (+15kV air discharge) on one input (Vin) and on one output (Vout)
Figure 4.
ESD response to IEC 61000-4-2 (-15kV air discharge) on one input (Vin) and on one output (Vout)
Input 10V/d
Input 10V/d
Output 10V/d
Output 10V/d
200ns/d
200ns/d
Figure 5.
Junction capacitance versus reverse voltage applied (typical values)
CLINE(pF)
28 26 24 22 20 18 16 14 12 10 0.0 0.5 1.0 1.5 2.0 2.5 3.0
VLINE(V)
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Ordering information scheme
EMIF06-VID01C2
2
Ordering information scheme
EMIF
EMI Filter Number of lines Information x = resistance value (Ohms) z = capacitance value / 10(pF) or 3 letters = application 2 digits = version Package C = Coated Flip-Chip x = 1: 500m, Bump = 315m = 2: Leadfree Pitch = 500m, Bump = 315m
yy
-
xxx zz
Cx
3
Package information
Figure 6. Flip-Chip Dimensions
315m 50 500m 50 250m 50
435m 50
690m 65
50 1
m
5
2.92mm 50m
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1.29mm 50m
0
EMIF06-VID01C2
Package information
Figure 7.
Footprint recommendations
Figure 8.
Marking
Copper pad Diameter : 250m recommended , 300m max
Dot, ST logo xx = marking z = manufacturing location yww = date code (y = year ww = week)
E
Solder stencil opening : 330m
Solder mask opening recommendation : 340m min for 300m copper pad diameter
xxz yww
Figure 9.
Flip-Chip Tape and reel specifications
Dot identifying Pin A1 location 4 +/- 0.1 O 1.5 +/- 0.1
1.75 +/- 0.1 3.5 +/- 0.1
0.78 +/- 0.05
All dimensions in mm
In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Note: More packing informations are available in the application note AN1235: "Flip-Chip: Package description and recommendations for use" AN1751: "EMI Filters: Recommendations and measurements"
8 +/- 0.3
ST E
ST E
ST E
xxx yww
User direction of unreeling
xxx yww
xxx yww
4 +/- 0.1
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Ordering information
EMIF06-VID01C2
4
Ordering information
Ordering code EMIF06-VID01C2 Marking GR Package Flip-Chip Weight 5.9 mg Base qty 5000 Delivery mode Tape and reel 7"
5
Revision history
Date 12-Aug-2005 01-Jun-2006 Revision 1 2 First issue. Reformatted to current standards. Modified marking illustration to remove dimensions. Depth dimension changed in Figure 9. Changes
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EMIF06-VID01C2
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